MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
Messen der Temperatur; Messen von Wärmemengen; Temperaturfühler, soweit nicht anderweitig vorgesehen
Измерение температуры; измерение количества тепла; термочувствительные элементы, не отнесенные к другим классам
Worldwide collection of published applications from PCT, US, EP, DE
An exhaust temperature measurement device (30) is provided with a first exhaust temperature output unit (31), a second exhaust temperature output unit (32), an over-correction determination unit (33a), and a parameter-setting unit (34). The first exhaust temperature output unit outputs an uncorrected value corresponding to the output of a temperature sensor. The second exhaust temperature output unit outputs a corrected value on the basis of a response-delay model. The over-correction determination unit determines whether the corrected value has been over-corrected or not, on the basis of the uncorrected value and the corrected value. The parameter-setting unit changes the parameters for the response-delay model on the basis of the determination results from the over-correction determination unit. As a result, it is possible to favorably correct (compensate for) the response delay of the temperature sensor.
DENSO CORP [JP]
ONO YOSHIHISA [JP]
G01K 7/00, F02D 45/00, G01K 13/02
The purpose of the present invention is to provide a platinum wire in which crystal growth is slowed to prevent damage resulting from creep without dispersing a metal oxide, and slip at crystal grain boundaries is slowed. A platinum thermocouple wire according to the present invention is used at the negative electrode of a platinum thermocouple and has a nitrogen mass concentration of 10 to 100 ppm. When the structure of the platinum thermocouple wire is observed in the longitudinal direction of the wire, a structure is observed in which there are a plurality of crystal grains in the wire thickness direction having an aspect ratio (major axis length/length of minor axis orthogonal to major axis) extending in the longitudinal direction of the wire of 5 or more.
FURUYA METAL CO LTD [JP]
MARUKO TOMOHIRO [JP], MIYAZAWA TOMOAKI [JP], SAITO SHOJI [JP], MORITA KENSUKE [JP] and others ...
04.04.2014 JP2014007742904.02.2015 JP20150020084
G01K 7/02, C22C 5/04
Apparatus and methods are provided for thermal energy metering by measuring the average temperature of fluid in a tank, such as a hot water storage tank. Average temperature is measured with an elongated temperature sensor wire that can span the vertical height of the tank. The sensor wire can be protected with a waterproofing jacket. The sensor wire can be coupled to a second substantially parallel wire. A processing unit measures temperature from changes in the resistance of the sensor wire and measures rates of change to allow the system to distinguish different sources of heat increase and/or decrease.
SUNNOVATIONS INC [US]
VAN HOUTEN ARNOUD B J [US], JOHNSON EVAN FAIR [US]
An exhaust temperature measurement device (30) is provided with a first exhaust temperature output unit (31), a second exhaust temperature output unit (32), an over-correction determination unit (33a), and a measured-value output unit (33b). The first exhaust temperature output unit outputs an uncorrected value corresponding to the output of a temperature sensor. The second exhaust temperature output unit outputs a corrected value on the basis of a response-delay model. The over-correction determination unit determines whether the corrected value has been over-corrected, on the basis of the uncorrected value and the corrected value. The measured-value output unit outputs the corrected value as the measured value if the over-correction determination unit does not determine an over-correction, and outputs a value which differs from the corrected value as the measured value if the over-correction determination unit determines that an over-correction has occurred. As a result, it is possible to minimize, as much ...
DENSO CORP [JP]
ONO YOSHIHISA [JP]
G01K 7/00, F02D 45/00, G01K 13/02
The invention relates to devices for indicating the history of products, e.g., with regard to the temperature progression. The device according to the invention comprises a covering layer, an indicator layer, an activator layer, and an optional delaying layer. By means of heating, moisture is released, which, in the case of some embodiments, migrates first into the delaying layer and then into the activator layer. There, an activator is mobilized and migrates together with the moisture into the indicator layer. By interaction of the indicator with the activator in the presence of moisture, a color conversion occurs, which indicates the exceedance of the critical temperature. The invention further relates to methods for producing the device according to the invention and to applications of the device according to the invention, e.g., in the temperature monitoring of sensitive products.
INNORESE AG [CH]
WÖTZER PHILIPP [AT]
A time-domain integrated temperature sensor, which uses a shaped clock signal to control the charging time of a capacitor, so that the capacitor generates a charging time delay signal which is relevant to an input clock cycle. The logical XOR operation is conducted on a time delay signal which is generated by charging the capacitor through a path of PTAT current in the above control manner and a time delay signal which is generated by charging the capacitor through a path of CTAT current in the same manner, so as to generate a pulse signal of which the width is relevant to both the temperature and the input clock cycle. Therefore, the same input clock signal is used to quantify the pulse width of the pulse signal, and the correlation between the obtained quantification result and the input clock cycle is completely offset, namely, an output value of the temperature sensor is irrelevant to an input clock signal cycle, thereby solving the problem that the existing time-domain integrated temperature sensor has ...
EXCELIO TECHNOLOGY SHENZHEN CO LTD [CN], WUXI EXCELIO TECHNOLOGY CO LTD [CN]
MA BILL [CN], WU PATRICK BIAN [CN], HAN FUQIANG [CN], QI SHEHU [CN] and others ...
Provided are a method for measuring the internal temperature of an object to be frozen and a device for measuring the internal temperature of an object to be frozen that make it possible to measure the internal temperature of an object to be frozen such as a frozen food that has been frozen. This method for measuring the internal temperature of an object to be frozen is provided with: a placement step for placing an object to be frozen in the resonance magnetic field of microwaves generated using a microwave resonator, a state detection step for using the microwave resonator to detect the resonance state of the object to be frozen in a frozen state and using a thermometer to detect the internal temperature of the object to be frozen, a calibration curve calculation step for calculating a calibration curve using regression analysis having the resonance state detected in the resonance detection step as the independent variable and the internal temperature of the object to be frozen detected by the thermometer ...
MAEKAWA SEISAKUSHO KK [JP]
KONO SHINJI [JP], HATTORI KAZUHIRO [JP]
G01K 7/00, G01K 11/00, G01N 22/00
A temperature sensor (1) is provided with: a temperature detection unit (2) that is provided with a temperature sensitive element (21); an element electrode line (23); a lead line (3); and an intermediate member (4). The element electrode line (23) has one end thereof embedded in the temperature detection unit (2), the lead line (3) is electrically connected to the element electrode line (23), and the intermediate member (4) is formed so as to electrically connect the element electrode line (23) and the lead line (3) to each other. The element electrode line (23) and the intermediate member (4) are disposed, in the extending directions thereof, on a same straight line, and are bonded to each other in a state wherein surfaces thereof facing each other are in contact with each other. The intermediate member (4) and the lead line (3) are, in the direction orthogonal to the extending direction, disposed by being aligned with each other and bonded to each other by overlapping each other.
DENSO CORP [JP]
YOSHIDA KOUICHI [JP], OZEKI TOSHIYA [JP]
G01K 7/18, G01K 7/22
It is proposed a differential temperature sensor (100) comprising: - a first piezoelectric substrate (10) made of a single crystal of lanthanum gallium silicate on which is arranged a first surface transverse wave resonator (11) having a first predetermined resonance configuration, - a second piezoelectric substrate (20) made of a single crystal of lanthanum gallium silicate on which is arranged a second surface transverse wave resonator (21) having a second predetermined resonance configuration identical to the first predetermined resonance configuration, the first piezoelectric substrate having a double-rotation cut which is different from the double-rotation cut angle of said second piezoelectric substrate.
CENTRE NAT RECH SCIENT [FR], ECOLE NATIONALE SUPERIEURE DE MECANIQUE ET DES MICROTECHNIQUES [FR]
BALLANDRAS SYLVAIN [FR], SAKLHAROV SERGEY [RU], NAUMENKO NATALYA [RU], PLESSKI VIKTOR [CH] and others ...
The invention relates to a measuring element (3) comprising a temperature sensor, a computer device (5), and a connecting interface (6) between the temperature sensor and the computer device (5), where the interface (6) transforms the reading of the sensor into an audio signal that can be processed by the computer device (5), using the method according to the invention.
FLORES CANALES JUAN JOSE [ES]
FLORES CANALES JUAN JOSE [ES]
The invention relates to a method for controlling the temperature of the resistance of electric and electronic resistors, where the control is effected by changing the output voltage by an electronic circuit (1). The change in the power supplied to the resistor (2) causes changes to the resistance value (2), allowing the integrated circuit (1), which monitors the resistance continuously, to know the temperature to which each resistance value corresponds. When the desired temperature is achieved, the electronic circuit changes the supplied power so that the resistance value (2), and thus the temperature value, is kept at the desired levels.
RAPTIS ATHANASIOS [GR]
RAPTIS ATHANASIOS [GR]
G01K 7/16, A24F 47/00, G05D 23/24
A method for determining waveguide temperature for at least one waveguide of a transceiver utilized for generating a temperature map. The transceiver generates an acoustic signal that travels through a measurement space in a hot gas flow path defined by a wall such as in a combustor. The method includes calculating a total time of flight for the acoustic signal and subtracting a waveguide travel time from the total time of flight to obtain a measurement space travel time. A temperature map is calculated based on the measurement space travel time. An estimated wall temperature is obtained from the temperature map. An estimated waveguide temperature is then calculated based on the estimated wall temperature wherein the estimated waveguide temperature is determined without the use of a temperature sensing device.
SIEMENS ENERGY INC [US]
DESILVA UPUL P [US], CLAUSSEN HEIKO [US], RAGUNATHAN KARTHIK [US]
23.04.2014 US201461983044P09.04.2015 US201514682393
G01K 7/42, G01K 11/24, G01P 5/24
Embodiments of the present disclosure are directed to a temperature indicator (e.g., a data logger) that is configured to be attached to a beverage container and to provide a user with information relating to the temperature history of the beverage. In some embodiments, for example, the temperature indicator is configured for attachment to a wine bottle. For instance, the temperature indicator may be configured to indicate whether the temperature of the wine bottle has deviated outside of a predetermined temperature range. In this way, the temperature indicator could be used to provide consumers, wine makers, distributors, or retailers with important information regarding the quality of care provided for the beverage container.
WINEFATHER INC [US]
PUCCINI STEVEN D [US]
G01K 1/14, G01K 1/20, G01K 11/16
Provided is a wiring substrate having reduced variation of electrical resistance caused by sublimation of platinum at high temperatures, in temperature-sensing wire-shaped conductors that include platinum. This wiring substrate (3) is provided with: an insulated substrate (1) comprising a plurality of laminated insulating layers (1a), and having an upper surface, a lower surface, and side surfaces; and a plurality of wire-shaped conductors (2) comprising platinum or containing platinum as the predominant component, having a first end portion (A) and a second end portion (B) on the opposite side from the first end portion (A), and being arranged between a plurality of layers among the plurality of insulating layers (1a). Of the wire-shaped conductors (2), the wire width of those positioned between layers closest to the upper surface or lower surface of the insulated substrate (1) is greater than the wire width of those positioned between the other layers. Due to the relatively greater absolute quantity of ...
KYOCERA CORP [JP]
MATSUMOTO HIROSHI [JP], MORIOKA KENGO [JP], HIRATA TAKAHITO [JP]
21.04.2014 JP2014008741619.06.2014 JP2014012642322.09.2014 JP20140192676
The present invention relates to a temperature sensor element. The temperature sensor element comprises: a ceramic element for a temperature sensor; a first electrode positioned on a first surface of the ceramic element for a temperature sensor; a second electrode positioned on a second surface of the ceramic element for a temperature sensor which is opposite to the first surface; a temperature sensor unit that includes a first lead wire connected to the first electrode and a second lead wire connected to the second electrode; and a protection unit that encloses the temperature sensor unit and is located to be spaced apart from the temperature sensor unit. Therefore, it is possible to prevent internal stress and cracks from being generated in the protection unit due to a difference in a coefficient of thermal expansion between the protection unit and the ceramic element for a temperature sensor in an environment with a large temperature change, thereby significantly reducing damage to the temperature sensor ...
LATTRON CO LTD [KR]
SOHN JAE CHEON [KR], LEE CHUNG KOOK [KR]
G01K 7/22, C04B 35/00, G01K 1/08, G01K 1/12
An apparatus for thermal management of a composite plies and adhesive applied to a repair area on a composite structure uses a combination of an optical scanner and projection system, coded photogrammetric targets, a coded two-dimensional thermocouple array and a coded heat blanket that all communicate with a computerized control system that develops spatial relationships between the composite structure being repaired, the repair area of the composite structure, the thermocouples used to monitor the temperatures in the repair area and the heat blanket used to heat the repair area. The optical scanner and projection system projects identifications of the thermocouples and the real time temperatures of the thermocouples at the positions of the thermocouples over the repair area on the composite structure.
BOEING CO [US]
SPALDING JOHN F [US], SHARP KRISTEN [US], BIRD MEREDITH M [US], LUTZ MELISSA [US] and others ...
G01K 1/02, B29C 35/02, B29C 73/12, B29C 73/34, G01K 7/21, B29C 73/30 A N
The purpose of the present invention is, in a terminal head provided to a sheathed temperature measurement sensor to connect the sheathed temperature measurement sensor and a cable, to facilitate the replacement of the sheathed temperature measurement sensor and minimize replacement parts. A terminal plate (2) of the terminal head (1) and a sheathed temperature measurement sensor (3) are joined using a pair of plug-in connectors (4, 5), and the joining is maintained by a joining nut (6). When the sheathed temperature measurement sensor (3) is replaced, the conducting wire (31) thereof does not have to be removed and attached at the replacement location on the terminal plate (2), and the only replacement part other than the sheathed temperature measurement sensor (3) is the connector (5).
OKAZAKI MFG COMPANY [JP]
TERADA MAKOTO [JP], YAMANA MASARU [JP], OKAZAKI KAZUHIDE [JP]
A distributed temperature sensor and a method of determining temperature are described. The distributed temperature sensor includes an optical fiber to filter or remove Stokes Raman scatter and prevent stimulated Raman scatter and a light source to inject light into the optical fiber. The distributed temperature sensor also includes a photodetector to detect light energy resulting from the light injected into the optical fiber, the light energy including anti-Stokes Raman scatter and Rayleigh scatter; and a processor to determine temperature based on a ratio of the anti-Stokes Raman scatter and the Rayleigh scatter.
BAKER HUGHES INC [US]
MITCHELL IAN [US], JOHNSTON WILLIAM [US], CHANDRAN ASHWIN [US]
G01K 11/32, E21B 49/00, G01K 13/10
In a connection device (1) for connecting at least two media conduits or for connecting one media conduit to an assembly, wherein the connection device (1) comprises a housing (10) with at least one inner medium channel (13) through which medium can flow, and at least one measurement device (2) with a sensor element (23) for determining at least one parameter of the medium, such as the temperature of the medium, the sensor element (23) of the measurement device (2) is received with a form fit and/or force fit and/or cohesive fit in a conductive material, sealingly with respect to the medium that flows or is able to flow through the medium channel (13), and the conductive material is connected with an integral bond to the adjacent material (17) of the housing (10) of the connection device (1), wherein the part of the measurement device (2); provided with the conductive material and/or the part of a wall (115, 215, 317) of the housing (10) of the connection device (1) delimiting the medium channel protrudes ...
VOSS AUTOMOTIVE GMBH [DE]
GMEINER SWEN [DE], DE BEER DANIEL [DE], SCHWARZKOPF OTFRIED [DE], ZWILLUS CHRISTIAN [DE] and others ...
G01K 1/14, F16L 41/00
A temperature prediction system and method thereof use sensors to sense the temperature at a plurality of times, thereby calculating an actual temperature difference between the current time and the previous time. According to the result of actual temperature difference, an adaptive filter is used to predict a predicted temperature difference at a future time and to add the temperature of the current time and the predicted temperature difference to render a predicted temperature. By calculating the difference between the temperature at the next time and the predicted temperature at the next time, the filter parameter of the adaptive filter is adjusted. This mechanism helps improving the accuracy in temperature predictions.
UNIV NAT TAIWAN [TW]
CHEN KUN-CHIH [TW], WU AN-YEU [TW], LI HUAI-TING [TW]
G01K 3/10, G01K 7/22
Temperature sensing circuitry implemented on a semiconductor integrated circuit that senses the temperature at a site, digitizes the sensed temperature, and then outputs a signal representing such a sensed temperature. The temperature sensing circuitry converts a voltage signal that is proportional to the temperature to a frequency-based signal, which is converted to a digital bit value. A scalar factor is applied to another voltage signal that is inversely proportional to the temperature to produce a scaled voltage signal. The scaled voltage signal is converted to a second frequency-based signal, which is converted to a digital bit value, and then the two digital bit values are compared. The temperature is determined when the digital bit values substantially match.
FREESCALE SEMICONDUCTOR INC [US]
RAMARAJU RAVINDRARAJ [US], BEARDEN DAVID R [US], MANICKAVASAKAM SUNITHA [US], MOORAKA VENKATARAM M [US] and others ...
A distributed temperature sensor, a method of determining temperature, and a processing system to compute temperature are described. The sensor includes an optical fiber disposed in an area where temperature is to be measured, a primary light source to inject light into the optical fiber, and a secondary light source to inject light into the optical fiber. The sensor additionally includes a photodetector to detect backscatter light energy from the optical fiber the backscatter light energy including Stokes Raman scatter or anti-Stokes Raman scatter and primary Rayleigh scatter resulting from the primary light source and secondary Rayleigh scatter resulting from the secondary light source, and a processor to determine temperature based on a ratio of the Stokes Raman scatter or the anti-Stokes Raman scatter and a combination of the primary Rayleigh scatter and the secondary Rayleigh scatter.
MITCHELL IAN [US], JOHNSTON WILLIAM [US], CHANDRAN ASHWIN [US], BAKER HUGHES INC [US]
MITCHELL IAN [US], JOHNSTON WILLIAM [US], CHANDRAN ASHWIN [US]
20.03.2015 US20151466425421.04.2014 US201461981980P
G01K 11/32, G01V 8/10
An on-chip temperature sensing device is disclosed. The disclosed on-chip temperature sensing device is capable of sensing an environmental temperature of the chip. The device comprises a reference generating circuit, a first oscillator, a second oscillator, and an arithmetic logic unit. The reference generating circuit is configured to generate a first control voltage to control the first oscillator and the second oscillator. The bias current of the first oscillator and the bias current of the second oscillator are both controlled by the first control voltage so that the bias current of the first oscillator is directly proportional the bias current of the second oscillator regardless the environmental temperature. The first oscillator generates a first oscillation signal, while the second oscillator generates a second oscillation signal. The arithmetic logic unit may calculate the environmental temperature according to the first oscillation signal and the second oscillation signal.
SILICON INTEGRATED SYS CORP [TW]
LIN SONG-SHENG [TW]
G01K 7/01, H03B 5/02
A thermal conductivity detector includes a switch controllable to short-circuit the input of an amplifier to improve the thermal conductivity detector for use in gas chromatography without the need of an additional reference cell, wherein a digital signal processor calculates a transfer function of an analog signal processor from a digitized difference signal received in response to short-circuiting the input of the amplifier at a given time when solely a reference carrier fluid passes through a measuring cell, and the digital signal processor recovers a detector signal by deconvoluting the digitized difference signal with a transfer function.
SIEMENS AG [DE]
SCHMIDT GLEN EUGENE [US], GELLERT UDO [DE], WANG AOSHENG [US]
G01K 17/00, G01K 3/08, G01N 25/18
Techniques for determining and using a thermodynamic model that characterizes a thermodynamic response of an enclosure conditioned by an HVAC system are disclosed. To determine a thermodynamic model, temperature information when the HVAC system operates in a first state may first be received. A response interval may then be determined where the response interval indicates an estimated time between when the HVAC system begins operating in the first state and when the temperature within the enclosure begins to change in a direction associated with the first state. Weighting factors corresponding to basis functions may then be determined, where the weighted basis functions characterize the temperature trajectory of the enclosure in response to the HVAC system operating in the first state. The basis functions may include a first basis function that is evaluated from a time that the HVAC system begins operating in the first state until a time when the response interval ends, and a second basis function that is ...
NEST LABS INC [US]
MALHOTRA KARA [US], MATSUOKA YOKY [US], MALHOTRA MARK [US], MINICH ALLEN [US] and others ...
G01K 13/00, F24F 11/00, G01M 99/00, G05B 15/02
A heat flux sensor to be attached to a hole portion formed in the surface of an object includes a body portion having an outer circumferential face that faces an inner circumferential face of the hole portion, and an exterior end face being flush with the surface of the object. The body portion is formed with a plurality of bored holes that extends from an outer face other than the exterior end face of the body portion, with respective tips of the bored holes being arranged on the same normal line of the exterior end face. The heat flux sensor is further provided with a plurality of heat sensors that have wiring lines leading to the outer face of the body portion through the bored holes, and a filling material that fills the bored holes to seal the heat sensors.
MITSUBISHI HEAVY IND LTD [JP]
MORIWAKI ATSUSHI [JP], TAJIRI SHINSUKE [JP], KAMAYA KAZUHIRO [JP], TSUBOUCHI MASANORI [JP] and others ...
27.12.2012 JP2012028591725.12.2013 WO2013JP84624
An embodiment provides a system, including: a sensor unit, comprising: a sensor that captures data; a memory storing data captured by the sensor; a photovoltaic cell operatively coupled to the sensor and the memory; the photovoltaic cell formed as a transparent layer; a display operatively coupled to the photovoltaic cell; a communication component that communicates the data captured by the sensor to a device; and a device that receives the data captured by the sensor via the communication component. Other aspects are described and claimed.
LENOVO SINGAPORE PTE LTD [SG]
DAVIS MARK CHARLES [US], JAKES PHILIP JOHN [US]
G01K 1/02, G01N 25/56, H01L 31/042
The present invention relates to a system, method, and apparatus for monitoring temperatures of food products. The system includes a temperature sensor and at least one server computer. The temperature sensor includes at least one processor, a sensor probe adapted for insertion in a food product, and a wireless transmitter, where the temperature sensor programmed or configured to sense temperature data for the food product, and wirelessly transmit the temperature data. The at least one server computer is programmed or configured to receive the temperature data wirelessly transmitted by the temperature sensor, and generate at least one user interface based at least partially on the temperature data.
INTELIGISTICS INC [US]
MANDAVA PANDURANGA RAO [US], KITHINJI ERICK JOHN MURIUNGI [US], PONNAGANTI NARAYANA [US]
21.04.2015 US20151469196421.04.2014 US201461982113P
G01K 1/02, G01K 1/08, G01K 13/00, G01N 33/02
The disclosure provides a mixed-mode temperature measurement communication phase conductor and a temperature measurement communication system. The mixed-mode temperature measurement communication phase conductor includes: a stainless sleeving optical unit and a support line hinged with the stainless sleeving optical unit, wherein an aluminium wire is hinged outside the stainless sleeving optical unit and the support line; the stainless sleeving optical unit includes: multiple single-mode fibres and at least one multi-mode fibre, wherein fibres in the stainless sleeving optical unit are mutually hinged. The disclosure realizes whole-distance temperature measurement of conductor by setting the single-mode fibre to perform communication and the multi-mode fibre to perform temperature measurement.
STATE GRID CORP CHINA [CN], STATE GRID BEIJING ELECTRIC POWER CO [CN], BEIJING ELECTRIC POWER ECONOMIC RES INST [CN]
SHU BIN [CN], ZHANG YING [CN], ZHANG KAI [CN], WANG WEIYONG [CN] and others ...
06.12.2012 CN2012152171216.07.2013 WO2013CN79466
G01K 11/32, G02B 6/44
A heat flow sensor (WFS) and use thereof, which heat flow sensor should have the lowest possible invasiveness and nevertheless is robust enough to satisfy the requirements of individual applications. For this purpose, the heat flow sensor includes an active sensor element, which is provided with a highly thermally conductive heat-conducting element (8, 9) on the cold side and on the hot side, wherein the sensor element is covered or encased by an extremely thin, electrically strongly insulating, chemically inert, and strongly adhering protective layer (6).
GREENTEG AG [CH]
DURRER LUKAS [CH], HELBLING THOMAS [CH], SCHWYTER ETIENNE [CH], GLATZ WULF [CH] and others ...
28.12.2012 CH2012000299223.12.2013 WO2013EP77912
A temperature monitoring and display system for use in data centers includes a magnetic layer that attaches to a server cabinet of a data center, and a flexible printed circuit board (FPCB). A plurality of lighting units and temperature sensors are mounted to the FPCB. An integrated controller of the temperature monitoring and display system receives temperature signals from the temperature sensors and, based on those signals, controls the lighting units to output predetermined colors.
DCIM SOLUTIONS LLC [US]
GENNELLO ANTHONY W [US]
15.03.2013 US20131383882816.03.2012 US201261611743P
In a portable electronic device components (2) consuming electrical power during operation may generate heat. A temperature sensor (1) for sensing an ambient temperature (TS) of the portable electronic device may as a consequence not supply the correct temperature value. It is suggested to provide a compensator (4) for determining a compensated ambient temperature (TA) dependent on at least the sensed ambient temperature (TS) and information (Pi) related to the electrical power consumed by at least one of the components (2). After a power down and a reactivation of the portable electronic device, actual internal states (x(b)) of the compensation model are estimated dependent on last internal states (x(a)) stored at the power down, dependent on an estimated course of the sensed temperature (T*S) between the interruption and the reactivation, and dependent on an estimated course of the information (P*i) related to the electrical power consumed by the at least one heat source (2) between the interruption and ...
SENSIRION AG [CH]
GRAF MARKUS [CH], TIEFENAUER ANDREAS [CH], SACCHETTI ANDREA [CH], NIEDERBERGER DOMINIK [CH] and others ...
02.11.2012 EP2012000749201.11.2013 WO2013CH00191
G01K 15/00, G01K 13/00
A foreign matter detection device of the present invention is provided with a temperature detection means that detects a temperature distribution in a magnetic field that is formed by a power-supplying device that transmits power wirelessly to a power-receiving device; and a signal processor that, based on a detection result from the temperature detection means, detects a conductive foreign matter in the magnetic field.
IHI CORP [JP]
NIIZUMA MOTONAO [JP]
08.01.2013 JP2013000107025.10.2013 WO2013JP78965
G01K 11/32, G01M 11/00, G01V 8/16
A temperature sensor element consists of a temperature sensing unit including: a temperature-sensing ceramic unit; first and second electrodes respectively positioned on first and second surface of the temperature-sensing ceramic unit, the second surface opposing the first surface; first and second intermediate electrodes respectively connecting to the first and second electrodes; and first and second lead lines connected to the first and second electrodes via the first and intermediate electrodes, respectively; and a protective unit surrounding the temperature sensing unit, wherein each of the first lead line and the second lead line includes a lead line core coated with a second layer, the lead line core and the second layer being different materials. The lead lines consist of the lead line cores of a metallic material cheaper than the platinum-based metal, which reduces the production cost of the lead lines.
LATTRON CO LTD [KR]
SOHN JAE CHEON [KR], LEE CHUNG KOOK [KR]
An apparatus, system and method for a time temperature indicator (TTI) which is capable of providing a summary of the time and temperature history of a good to which it is coupled, optionally including with regard to providing an indication as to whether one or more temperature thresholds have been breached. According to other embodiments, the TTI specifically provides an indication as to whether a temperature threshold at or around the freeze point has been breached, optionally even without providing a time and temperature history.
FRESHPOINT QUALITY ASSURANCE LTD [IL]
SALMAN HUSEIN [IL]
15.12.2014 US20141457107416.06.2013 WO2013IL5051215.06.2012 US201261660457P15.12.2013 US201361916237P
Provided is an overheat detection circuit configured to accurately detect a temperature of a semiconductor device even at high temperature and thus avoid outputting an erroneous detection result. The overheat detection circuit includes: a PN junction element, being a temperature sensitive element; a constant current circuit configured to supply the PN junction element with a bias current; a comparator configured to compare a voltage generated at the PN junction element and a reference voltage; a second PN junction element configured to cause a leakage current to flow through a reference voltage circuit at high temperature; and a third PN junction element configured to bypass a leakage current of the constant current circuit at the high temperature.
SEIKO INSTR INC [JP]
SUGIURA MASAKAZU [JP], TOMIOKA TSUTOMU [JP], SAWAI HIDEYUKI [JP], IGARASHI ATSUSHI [JP] and others ...
G01K 7/01, G01K 13/00, H01L 27/02
The present invention, in one aspect, provides a method for calibrating thermal control elements in situ using a single compound calibrator. In some embodiments, the present invention uses a compound calibrator to calibrate thermal control elements on a microfluidic device. In non-limiting embodiment, the compound calibrator can be a droplet, plug, slug, segment or continuous flow of any appropriate solution that, when heated, yields a thermal response profile with a plurality of features (e.g., maxima, minima, inflection points, linear regions, etc.).
CANON US LIFE SCIENCES INC [US]
COURSEY JOHNATHAN S [US], HASSON KENTON C [US]
29.06.2015 US20151475376531.08.2011 US20111322327031.08.2010 US20100378591P
G01K 15/00, G01K 11/06
A method of monitoring an electrical device includes receiving an operational condition of an electrical device, receiving a measurement indicative of a thermal parameter of the electrical device corresponding to the operational condition, and storing the measurement in memory in association with the operational condition. A system for monitoring electrical devices includes a processor communicative with a memory and the memory has instructions recorded thereon that, when read by the processor, cause the processor to execute the method.
KIDDE TECH INC [US]
SCHNETKER TED R [US]
G01K 13/00, G01J 5/10
A temperature sensor comprising a housing having a housing body and a housing chamber, in which housing chamber are arranged terminally two temperature sensor elements, which are especially embodied as thin-film resistance thermometers, one of the temperature sensor elements is heatable, and from each temperature sensor element at least one connection wire leads away, which is connected with a circuit board. The circuit board is arranged in the housing chamber. The circuit board is positioned in the housing chamber by a snap-in connection. A connection wire of a first temperature sensor element is led with strain relief in a first direction through the circuit board and connected with such. The housing chamber contains at least a first elastic body. The circuit board has a first number of cavities, for connection of connection wires and/or cables and a second number of cavities, for reducing thermal expansion of the circuit board. Also presented is a thermal, flow measuring device.
FLOWTEC AG [CH]
GRUN ALEXANDER [DE], SCHULTHEIS HANNO [DE], BAUR TOBIAS [CH]
19.10.2012 DE201220104039U29.07.2013 DE201320103404U23.09.2013 WO2013EP69680
G01K 7/16, G01F 1/692, G01F 1/696
A semiconductor device that may include at least one temperature sensing circuit is disclosed. The temperature sensing circuits may be used to control various operating parameters to improve the operation of the semiconductor device over a wide temperature range. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without compromising performance at other operating temperatures. The temperature sensing circuit may provide a plurality of temperature ranges for setting the operational parameters. Each temperature range can include a temperature range upper limit value and a temperature range lower limit value and adjacent temperature ranges may overlap. The temperature ranges may be set in accordance with a count value that can incrementally change in response to the at least one temperature sensing circuit.
WALKER DARRYL G [US]
WALKER DARRYL G [US]
30.04.2014 US20141426565328.03.2014 US201461971702P
G01K 7/16, G11C 7/00